Low-viscosity, unfilled epoxy casting resin system that cures at room temperature. High filler addition possible.
Application:
Encapsulation or potting of low voltage and electronic components.
Processing methods:
Casting; Vacuum casting
Main properties:
Good resistance to heat.
Good resistance to atmospheric and chemical decomposition.
Glass transition temperature (Tg) 64°C
| Viscosity | ISO 2555 | mPa*s | 1350 - 2000* |
| Specific gravity at 25°C | ISO 2811 | g/cm³ | 1.15 |
| Appearance | Visual | clear liquid* | |
| Epoxy content | ISO 3001 | Eq/kg | 4.20 - 4.35* |
| Viscosity | ISO 12058 | mPa*s | 370-470* |
| Specific gravity at 25°C | ISO 2811 | g/cm³ | 1.03 |
| Appearance | Visual | Clear liquid* |
*Specified range
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