DOTEC®up to 1100 °C

Our materials

DOTEC comprises a wide range of high-tech materials based on resin systems such as glass, phenolic or silicate resin. Mica, glass or aramid fiber are used as carrier materials.

DOTEC materials are characterized by the following properties:

Good mechanical strength
Very good dimensional stability
Good temperature stability
Low thermal conductivity
Good electrical insulating effect
Good friction and sliding properties
Chemical resistance
Suitable for clean room applications (especially glass-bonded mica material)

DOTEC comprises a wide range of our high-tech materials, which are suitable for a wide variety of applications.

	Application temperature (°C)	Application temperature (°C)	Compressive strength (N/mm2)	Bending strength ((N/mm2)	Thermal conductivity(W/mK)	Layer expansion coefficient (10-6 I/K)	Dielectric strength (KV/3mm)	Creep current resistance	Flammability UL94
	permanent	short term	at 23°C	at 23°C
DOTHERM® 700	700	700	120	32	0,37	6	8,7	-	> 370
DOTHERM® 1000	1000	1000	35	18	0,50	6,4	14,1	CTI 600	> 420
DOTHERM® 1100	1100	1100	16	7	0,1	7	-	-	-
DOTHERM® 600 M	600	600	400	230	0,26	10	75	CTI 500	> 420
DOTHERM® 800 M	800	800	330	170	0,26	10	75	CTI 525	> 420
DOTEC® 200	200	220	330	100	0,3	13	-	-	-
DOTEC® 280	280	300	150	30	0,28	20	-	-	-
DOTEC® 350	350	400	38	20	0,12	40	20	-	-
DOTEC® 500 M	500	500	310	85	0,87	11	86,1	CTI 600	> 245
DOTEC® 600	600	600	220	76	1,32	10	49,5	CTI 600	> 345
DOFLEX® MSP	700	1000	-	-	0,2	-	60	-	-
DOFLEX® CM 30	1000	1100	-	-	0,1	-	69	-	-