Casting systems for processing and curing at room temperature or slightly higher temperatures High filler addition capability
Application:
Encapsulation or potting of low voltage and electronic components.
Processing method:
Casting
Main features:
The flexibility of the castings can be adapted to the requirements by combining CY 220 -1/ CY 221 in various ratios
Low tendency to crack
Glass transition temperature (Tg) 29°C
| Viscosity at 25°C | mPa s | ca.5000 |
|
| Specific gravity at 25°C | g/cm³ | 1.15* | |
| Flash point | DIN 51 758 | °C | 190-200 |
| Epoxy content | Eq/Kg | 5.0 | |
| Appearance | Visual | Pale yellow liquid |
| Viscosity at 25°C | mPa s | approx. 450 |
|
| Specific gravity at 25°C | g/cm³ | 1.15* | |
| Flash point | DIN 51 758 | °C | 190-200 |
| Epoxy content | Eq/Kg | 4.05 | |
| Appearance | Visual | Clear liquid |
| Viscosity at 25°C | mPa*s | 450* |
|
| Specific gravity at 25°C | g/cm³ | 1.02* | |
| Flash point | DIN 51 758 | °C | 1.02* |
| Appearance | Visual | Clear, light yellow liquid* |
*Specified range
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